{"id":3042,"date":"2023-09-01T11:47:29","date_gmt":"2023-09-01T09:47:29","guid":{"rendered":"https:\/\/www.eledia.org\/eledia-tsinghua\/?post_type=news&#038;p=3042"},"modified":"2023-09-01T11:51:52","modified_gmt":"2023-09-01T09:51:52","slug":"new-special-section-on-deep-learning-based-forward-and-inverse-electromagnetic-characterization","status":"publish","type":"news","link":"https:\/\/www.eledia.org\/eledia-tsinghua\/news\/new-special-section-on-deep-learning-based-forward-and-inverse-electromagnetic-characterization\/","title":{"rendered":"New Special Section on &#8220;Deep Learning Based Forward and Inverse Electromagnetic Characterization&#8221;"},"content":{"rendered":"\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" width=\"1024\" height=\"1024\" src=\"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-content\/uploads\/2023\/09\/2023-08-28.Social-Post.ELEDIA.SI_.JMMCT_.LI-Maokun-1024x1024.png\" alt=\"\" class=\"wp-image-3043\" srcset=\"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-content\/uploads\/2023\/09\/2023-08-28.Social-Post.ELEDIA.SI_.JMMCT_.LI-Maokun-1024x1024.png 1024w, https:\/\/www.eledia.org\/eledia-tsinghua\/wp-content\/uploads\/2023\/09\/2023-08-28.Social-Post.ELEDIA.SI_.JMMCT_.LI-Maokun-300x300.png 300w, https:\/\/www.eledia.org\/eledia-tsinghua\/wp-content\/uploads\/2023\/09\/2023-08-28.Social-Post.ELEDIA.SI_.JMMCT_.LI-Maokun-150x150.png 150w, https:\/\/www.eledia.org\/eledia-tsinghua\/wp-content\/uploads\/2023\/09\/2023-08-28.Social-Post.ELEDIA.SI_.JMMCT_.LI-Maokun-768x768.png 768w, https:\/\/www.eledia.org\/eledia-tsinghua\/wp-content\/uploads\/2023\/09\/2023-08-28.Social-Post.ELEDIA.SI_.JMMCT_.LI-Maokun.png 1440w\" sizes=\"(max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p>The ELEDIA Research Center is pleased to announce the upcoming Special Section on<br><br>&#8220;Deep Learning Based Forward and Inverse Electromagnetic Characterization&#8221;<br><br>guest edited by Abdulkadir C. YUCEL, Jiefu CHEN, and Maokun LI on the <a href=\"https:\/\/www.linkedin.com\/company\/ieee-jmmct\/\">IEEE Journal on Multiscale and Multiphysics Computational Techniques<\/a>.<br><br>\ud83d\udcc5 The submission deadline is set to February 29, 2024.<\/p>\n","protected":false},"author":1,"featured_media":3043,"template":"","format":"standard","meta":[],"tags":[526],"news_status":[],"news_topic":[218],"acf":[],"_links":{"self":[{"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/news\/3042"}],"collection":[{"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/types\/news"}],"author":[{"embeddable":true,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/users\/1"}],"version-history":[{"count":3,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/news\/3042\/revisions"}],"predecessor-version":[{"id":3046,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/news\/3042\/revisions\/3046"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/media\/3043"}],"wp:attachment":[{"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/media?parent=3042"}],"wp:term":[{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/tags?post=3042"},{"taxonomy":"news_status","embeddable":true,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/news_status?post=3042"},{"taxonomy":"news_topic","embeddable":true,"href":"https:\/\/www.eledia.org\/eledia-tsinghua\/wp-json\/wp\/v2\/news_topic?post=3042"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}